The Study of the Multi-Header Hot Bar in Bonding Process by FEA

Abstract

The reflow interconnection is a common
connection between the head gimbal assembly (HGA) and
the E-Block in a manufacturing process of hard disk drive.
Sometimes the interconnection process is called lapping
bonding. At present, the reflow process uses one header of
the hot bar at a time for bonding. However, time to market
is very important. Such the approach is time consuming
for the hard disk drive production. In this study, the finite
element method was used for improvement the reflow
process which twelve headers of the hot bar were used at
a time for bonding. The even number of the hot bars was
recommended. In addition, the heat transfer was
considered carefully by control the hottest area and
uniformity of the heat distribution on the reflow area. The
results from peel test and electrical test revealed that the
quality of lapping bonding by multi header can be
compared with that by one header. Increasing of the hot
bar header is able to increase the percent of UPH as well.